Steel For BGA Stencil Kit 27PCS for Reballing Integrated Circuits with Standard Pitch Including 0.5mm to 1.27mm
27-Piece Stainless Steel For BGA Stencil Set Designed for Direct Heat Application in IC Reballing and Rework Processes
CWOQOCW Steel For BGA Stencil Kit for Solder Ball Grid Array Rework with 10 Mesh Templates Covering 0.58mm to 1.27mm Pitch and 0.3mm to 0.76mm Holes (90X90)
JoyousMall BGA Stencil Kit, 90X90 80X80 for versatile for BGA Stencil Kit 10pc Solder Ball Grid Array for Electronics Rework
NbgrvB for Stainless Steel for BGA for Memory Stencil Set DDR1-DDR7 NAND Chips with Direct Heating Bracket, 12/14/20-Piece 20PCS
MoSundi 27 Pcs Steel for BGA Reballing Stencil Set, Assorted Sizes for IC Chip Repair and Rework, Direct Heating Compatible, Silver
