ZASCHMOY Universal BGA Reballing Stencil - Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair - Durable Stainless Steel Material with Four Pitches
Taidda Universal BGA Reballing Stencil Versatile Stainless Steel Template for Phone IC Chips Repair Compact Appearance for Common ICS
Generic Universal BGA Reballing Templates Heat Resistant 144 Pcs Set for Laptop Desktop Graphics Card Repair
Generic Stainless Steel Universal BGA Reballing Stencil Four Pitch Tin Mesh Solder Template for Cell Phone Repair, Precise Positioning for Fast Implantation
Kadimendium Universal BGA Reballing Stencils Kit for Communication Main Board, High-Quality Heat Template Mesh 130pcs
Premium Universal BGA Reballing Stencil Kit High Precision Tin Mesh Solder Ball Template for Smartphone IC Chip Repair Professional Grade Stainless Steel Tool
